Photofabrication supply RFI Shielding solutions using various intelligent design techniques.
These can be applied to a variety of metals, most popular being Nickel Silver (maintains solderability with no post coating required), or traditionally either a brass or mild steel coated with either tin or nickel plating (depending on your requirements). The full process is available, including forming, plating, soldering and / or spot welding.
For bespoke RFI Shielding products the manufacturing technique of choice is Chemical Milling, let us illustrate this in more detail:
Main Benefits of Chemical Milling:
Features of RFI Products through Chemical Milling:
The Benefits of Shielding at PCB Level
SHIELDING AT PCB BOARD LEVEL – A deceptively simple technique for controlling EMC (Electro-Magnetic Compatibility). Perhaps the most common technique to keep harmful interference out and also unwanted emission in.
Solutions at Product Enclosure Level – Why This is Unadvisable
Practical EMC shielding requires considerable engineering skill to give good results. However, at product enclosure level, it can be complex and expensive when taking into account both additional material and assembly costs. Also, effective enclosure shielding usually requires substantial filtering of all cables, which pass out of the product right at the point where they penetrate the enclosure shield.
Why Use Shielding at PCB Level?
Shielding at PCB level, however, is simple and low cost. Board level shielding solutions can be used to achieve an EMC performance that would be far more difficult and costly at product enclosure level.
At board level, shielding cans can be used selectively on problem areas of a circuit, directly tackling components with emissions that are too high or are too sensitive.
In brief, PCB shielding cans are simple metal boxes that are easily soldered in place. Dealing with EMC problems at this level, ensures component and assembly costs are low and the appearance and ease of maintenance of the product are not compromised.
Effect on Emissions
With this method of execution, the circuit board tracking and wiring is shielded inside the can solution. Due to space, contained tracks and wires are consequently very short and not very efficient as aerial radiating RFI or EMI. Furthermore, filtering to reduce overall emissions to an acceptable level, may be minimal if required at all.
To find out more about the Photo Etching Process please either contact us on 01480 226699, or take “The Process Tour”.